| PATENT REGISTER | |||
| Status | Lapsed | Patent No. | 1245328 |
|---|---|---|---|
| Application No. | 01400534.2 | Date of Filing | 01/03/2001 |
| Date Grant Published | 16/06/2010 | Application Published | 02/10/2002 |
| Title of Invention | Use of silver in a lead-free solder paset | ||
| Priority | |||
| Inventors |
Katoh, Rikiya Munekata, Osamu Toyoda, Yoshitaka |
||
| Current Proprietor |
SENJU METAL INDUSTRY CO., LTD. 23 Senju-Hashido-cho Adachi-ku Tokyo, 120-8555 JAPAN |
||
| Publication Language | English | ||
| Translation Received Date | |||
| 25/06/2010 | Divisional Application number: 09175462.2 Publication number: 2147740 Date of receipt: 10/11/2009 | ||
| 16/12/2011 | Patent lapsed due to non-payment of Patent Renewal Fee in respect of year 11. | ||
| 13/06/2013 | Title Changed From "Lead-free solder paste" To "Use of silver an a lead-free solder paset" | ||
| 21/12/2017 | Title Changed From "Use of silver an a lead-free solder paset" To "Use of silver in a lead-free solder paset" | ||
| 21/12/2017 | Amendment of patent specification as a result of opposition proceedings at the EPO on 20/12/2017 | ||
| 26/07/2018 | Correction of Patent Specification on 25/07/2018 (B9) | ||
