| PATENT REGISTER | |||||||||
| Status | Lapsed | Patent No. | 2818526 | ||||||
|---|---|---|---|---|---|---|---|---|---|
| Application No. | 14174709.7 | Date of Filing | 27/06/2014 | ||||||
| Date Grant Published | 22/06/2016 | Application Published | 31/12/2014 | ||||||
| Title of Invention | Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applications | ||||||||
| Priority |
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| Inventors |
Shi, Xiaobo Murella, Krishna P. Schlueter, James Allen Choo, Jae Ouk |
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| Current Proprietor |
AIR PRODUCTS AND CHEMICALS, INC. 7201 Hamilton Boulevard Allentown, PA 18195-1501 UNITED STATES OF AMERICA |
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| Publication Language | English | ||||||||
| Translation Received Date | |||||||||
| 03/03/2017 | Patent lapsed due to non-payment of Patent Renewal Fee in respect of year 3. | ||||||||
